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Research area

Intelligent chip engineering refers to two closely linked disciplines: AI-driven chip design (using AI to create chips) and AI hardware design (building chips specifically designed to run AI models). Together, they are redefining semiconductor innovation to meet the demands of modern computing.

R&D Project

ํ•œ๊ตญ์—ฐ๊ตฌ์žฌ๋‹จ (NRF)
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๊ฒฐ์ •-๋น„์ •์งˆ ๋‚˜๋…ธ์ฝคํฌ์ง€ํŠธ ๊ทน๋ฐ•๋ง‰ ํŠน์ด์ „๋„ ์†Œ์žฌ ๊ฐœ๋ฐœ ๋ฐ ๋‹ค์ง„๋ฒ•์ปดํ“จํŒ… ์‘์šฉ๊ธฐ์ˆ  ๊ฒ€์ฆ (Oct. 2022 โ€“ Jun. 2027)
์ •๋ณดํ†ต์‹ ๊ธฐํšํ‰๊ฐ€์› (IITP)
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PIM ๋ฐ˜๋„์ฒด ์„ค๊ณ„๋ฅผ ์œ„ํ•œ ์˜คํ”ˆ์†Œ์Šค ๊ธฐ๋ฐ˜์˜ ๋ฐ˜๋„์ฒด ์„ค๊ณ„ ๊ธฐ์ˆ  ๊ฐœ๋ฐœ (Apr. 2025 - Dec. 2028)
SK ํ•˜์ด๋‹‰์Šค
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AI EDA ๊ธฐ๋ฐ˜ IGZO 2T DRAM ์„ค๊ณ„ ํŒŒ๋ผ๋ฏธํ„ฐ ์ตœ์ ํ™” (Aug. 2025 - Jul. 2028)
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๋ฏธ๋ž˜ high density DRAM์— ์ ํ•ฉํ•œ S/A ๋ฐ offset ์ €๊ฐ ๊ธฐ์ˆ , ์ €์ „์•• ํšŒ๋กœ ๊ธฐ์ˆ  ๋™ํ–ฅ (Aug. 2025 - Jul. 2028)

Reserach Topic

1. NPU: AI Chip Design based on Neural Procssing Unit

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RNN-based AI Chip Design for DPD in 6G Communication
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VAE-based AI Chip Design for EMIC

2. PIM: AI Chip Design based on Processing-In-Memory

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PIM Architecture-based RTL Synthesizer/Compiler

3. SoC: System-on-Chip Design for Emerging Technology

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Ternary CPU Design using Ternary EDA Tool
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IGZO-based 2T0C DRAM Circuit Design

4. EDA: AI-Driven Electronic Design Automation

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RL-based Parameter Extraction for Device Compact Model Generatrion
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Automatic Test Pattern Generation (ATPG) for DFT of Ternary SoC
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AI-Driven Floorplan for Phsyical Design

Previous R&D Project

ํ•œ๊ตญ์—ฐ๊ตฌ์žฌ๋‹จ (NRF)
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Memcapacitor-based Multi-Valued Logic Architecture Research (Sep. 2017 - Feb. 2023)
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Multi-Valued Logic Device Integration & Architecture Platform Research (Jun. 2019 โ€“ Dec. 20)
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Graphene Barristor-based Ternary Logic Architecture Research (Aug. 2016 - Jul. 2021)
์‚ผ์„ฑ๋ฏธ๋ž˜๊ธฐ์ˆ ์œก์„ฑ์‚ฌ์—…
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2D Semiconductor Heterojunctions-based Ternary/Quaternary Circuit Reasearch (Jun. 2020 โ€“ May. 2022)
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Ternary CMOS-based Ultra-Low Power Neural Network IC Design (Aug. 2017 - Jul. 2018)
์‚ฐ์—…์ฒด
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IDEAS2SILICON: Development of a Low-Latency RNN-Based DPD AI Chip Design and Verification Platform for 6G Communication (2025 - 2026)
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EMCORETECH: Development of a Versatile Electromagnetic Interference Control IC by Hardware Control (2024 - 2025)
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Samsung Display Company: Display Driver IC Design for a Very High Resolution TFT LCD Panel ( 2016 - 2017)